Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier

ABSTRACT

Methods of processing electronic device workpieces and methods of positioning electronic device workpieces are provided. According to one aspect, a method of processing electronic device workpieces, individual electronic device workpieces having a front surface and a back surface, includes providing an electronic device workpiece carrier including a plurality of workpiece receivers; positioning individual electronic device workpieces within the workpiece receivers, the positioning orienting the front surface of one electronic device workpiece to face the front surface of a first immediately adjacent electronic device workpiece and orienting the back surface of the one electronic device workpiece to face the back surface of a second immediately adjacent electronic device workpiece; and positioning the electronic device workpiece carrier within an electronic device workpiece processor after the positioning of the individual electronic device workpieces, and processing the electronic device workpieces with the electronic device workpieces so oriented.

TECHNICAL FIELD

The present invention relates to electronic device workpiece carriers,methods of processing electronic device workpieces, and methods ofpositioning electronic device workpieces within a workpiece carrier.

BACKGROUND OF THE INVENTION

Semiconductor wafer carriers, also referred to as semiconductor wafercassettes, are known in the art. Such carriers are typically utilizedfor storage, transportation and processing of semiconductor wafers. Thesemiconductor wafer carriers are configured to carry a plurality ofsemiconductor wafers or workpieces. In particular, the semiconductorwafer carriers usually include a plurality of slots individuallyconfigured to receive a single semiconductor wafer.

Typically, the semiconductor wafers are arranged within the wafercarrier outside of a semiconductor processor. The semiconductor wafercarrier is thereafter transported, with the semiconductor wafers inside,into the processing apparatus. Some semiconductor processors aretypically configured to process the semiconductor wafers within thewafer carrier.

During most wafer processing steps, it is preferred or necessary tocompletely expose the front surfaces of the semiconductor wafers beingprocessed to ensure complete processing. Therefore, the front surfacesof the semiconductor wafers being processed are spaced from other wafersor wafer carrier surfaces to facilitate complete exposure of thesurfaces to processing fluids. In the prior art, semiconductor wafersare arranged with their front surfaces facing in one direction.Additionally, one empty slot is usually provided intermediateimmediately adjacent semiconductor wafers to facilitate exposure of therespective front surfaces of the wafers to the processing fluids.

Conventional spacing or arrangement of the semiconductor wafers reducesthe number of semiconductor wafers which can be loaded into a wafercarrier. Accordingly, fewer semiconductor wafers are processed within asingle wafer carrier reducing processing throughput.

In addition, the diameter of semiconductor wafers continues to increaseas the demand for higher chip and die yields from a single semiconductorwafer increases. Providing semiconductor wafers having increaseddiameters has resulted in a need for improved processing methods andapparatus.

SUMMARY OF THE INVENTION

The present invention provides workpiece carriers individuallyconfigured to receive a plurality of electronic device workpieces.Further, methods are provided for processing electronic deviceworkpieces and positioning electronic device workpieces within aworkpiece carrier. Provision of the electronic device workpieces withinthe workpiece carrier in accordance with the present inventionfacilitates processing of the electronic device workpieces.

One embodiment of the present invention provides an electronic deviceworkpiece carrier which includes a body and a plurality of workpiecereceivers defined by the body. At least some of the workpiece receiversof the workpiece carrier are spaced from immediately adjacent workpiecereceivers at different distances.

Electronic device workpieces are preferably arranged in pairs in certainembodiments of the present invention. Some pairs of electronic deviceworkpieces are spaced farther apart than other pairs of electronicdevice workpieces according to one aspect of the present invention. Oneelectronic device workpiece may be common to more than one pair ofworkpieces.

One method of processing electronic device workpieces according to thepresent invention provides arranging of pairs of electronic deviceworkpieces within workpiece receivers of a workpiece carrier. Frontsurfaces of electronic device workpieces face one another in some pairsof workpieces, and back surfaces of electronic device workpieces faceone another in other pairs of workpieces. The faced front surfaces ofimmediately adjacent electronic device workpieces are preferably spacedby a distance which is greater than a distance intermediate faced backsurfaces of immediately adjacent electronic device workpieces.Alternatively, greater spacing is provided intermediate faced backsurfaces compared with the spacing intermediate faced front surfaces.Such an arrangement is typically utilized when processing of the backsurfaces of the workpieces is desired.

Pairs of electronic device workpieces arranged within workpiecereceivers of the workpiece carrier are spaced by at least one emptyworkpiece receiver in some embodiments of the invention.

Electronic device workpieces are processed according to certain aspectsof the invention following arrangement of the workpieces within theworkpiece carrier. Such processing includes wet processing of theelectronic device workpieces in some embodiments. Arrangement of theelectronic device workpieces within a workpiece carrier in accordancewith the present invention improves manufacturing efficiency of theworkpieces.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is an isometric view of a workpiece carrier holding a pluralityof electronic device workpieces.

FIG. 2 is an elevated top view of the workpiece carrier shown in FIG. 1.

FIG. 3 is an elevated top view showing guides of the workpiece carrierin detail.

FIG. 4 is a cross-sectional view of the workpiece carrier taken alongline 4—4 of FIG. 2.

FIG. 5 is a cross-sectional view taken along line 5—5 of FIG. 4 showingupper portions of guides of the workpiece carrier.

FIG. 6 is a cross-sectional view taken along line 6—6 of FIG. 4 showinglower portions of guides of the workpiece carrier.

FIG. 7 is a cross-sectional view, similar to FIG. 6, of pluralelectronic device workpieces arranged intermediate selected guides ofthe workpiece carrier.

FIG. 8 is a cross-sectional view, similar to FIG. 6, of anotherarrangement of electronic device workpieces intermediate selected guidesof the workpiece carrier.

FIG. 9 is a cross-sectional view, similar to FIG. 8, illustrating analternative embodiment of guides of a workpiece carrier.

FIG. 10 is an isometric view of a workpiece carrier including pluralelectronic device workpieces within a workpiece processor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of theconstitutional purposes of the U.S. Patent Laws “to promote the progressof science and useful arts” (Article 1, Section 8).

Referring to FIG. 1, one embodiment of a workpiece carrier 10 configuredto store plural electronic industry workpieces or electronic deviceworkpieces W is shown. Exemplary electronic device workpieces W includesemiconductor wafers, glass or quartz substrates for flat panel or fieldemission display devices, etc. Such electronic device workpieces W cancomprise silicon, glass, quartz or other materials. Typical workpieces Ware processed and subsequently utilized in electronic devices of variousconfigurations.

The illustrated workpiece carrier 10 includes a first side 14 and asecond side 15 opposite first side 14. Workpiece carrier 10 alsoincludes a front portion or side 16 and a rear or back portion 17.Workpiece carrier 10 generally includes a body 12. Body 12 defines aninternal bay portion 11 for receiving a plurality of vertically orientedelectronic device workpieces W. Body 12 of workpiece carrier 10 toincludes a pair of parallel legs 22, 23 for supporting workpiece carrier10 and workpieces W therein. Further, body 12 of workpiece carrier 10includes a handle 13 for facilitating handling of workpiece carrier 10and electronic device workpieces W therein.

Referring to FIG. 2, internal bay portion 11 is shown. Bay 11 isconfigured to receive plural electronic device workpieces W (oneelectronic device workpiece is shown in phantom in FIG. 2). Internal bayportion 11 of body 12 has a basket-like configuration in the illustratedembodiment. Side portions 14, 15 of body 12 define plural slots orworkpiece receivers 30. Workpiece receivers 30 are configured to receiveand hold electronic device workpieces W. Workpiece receivers 30 areadapted to hold electronic device workpieces W in a vertical orientationwithin bay portion 11.

In the illustrated embodiment, side portion 14 defines plural workpiecereceivers 30 and opposite side portion 15 defines plural workpiecereceivers 30 which correspond to the workpiece receivers of side portion14. Corresponding workpiece receivers of side portions 14, 15 areconfigured to receive electronic device workpieces W. A pair ofworkpiece receivers 30 receives a single electronic device workpiece Was shown. Although only three workpiece receivers 30 of individual sideportions 14, 15 are labeled with reference numbers in FIG. 2, workpiecereceivers 30 laterally extend along the respective sides 14, 15 in thepreferred embodiment. Sides 14, 15 respectively include a plurality ofspacers or guides 40 which define workpiece receivers 30.

Referring to FIG. 3, guides 40 of workpiece carrier 10 are shown indetail. Guides 40 are configured to receive and support electronicdevice workpieces W within workpiece receivers 30. Individual workpiecereceivers 30 are configured to receive a single electronic deviceworkpiece W in the described embodiment. In particular, two immediatelyadjacent guides 40 form a single workpiece receiver 30 and support asingle electronic device workpiece W. Workpiece carrier 10 may beconfigured for either full V-slot spacing or half V-slot spacing. Aworkpiece carrier 10 configured for full V-slot spacing typicallyprovides twenty-five V-slots or workpiece receivers 30 per workpiececarrier 10. A workpiece carrier 10 configured for half V-slot spacingtypically provides fifty V-slots or workpiece receivers 30 per carrier10.

Referring to FIG. 4, receiving bay 11 of workpiece carrier 10intermediate sides 14, 15 is shown. Positioning of an electronic deviceworkpiece W within bay 11 is shown in phantom in FIG. 4. Guides 40defined and supported by sides 14, 15 are configured to verticallyorient electronic device workpieces W within workpiece carrier 10 forstorage and processing. Sides 14, 15 have respective lip portions 18, 19and legs 22, 23. Guides 40 extend from lip portions 18, 19 to respectiveleg portions 22, 23 in the illustrated embodiment. Guides 40 areconfigured to receive electronic device workpieces W and preventexcessive horizontal movement of the workpieces within bay 11 duringmovement of the workpiece carrier 10 and processing of the electronicdevice workpieces W.

Referring to FIG. 5, an array 41 of plural upper portions 42 of guides40 is shown. All guides 40 include upper portions 42 in the preferredembodiment of the invention although only seven upper portions 42 areshown in FIG. 5. Pairs of immediately adjacent guides 40 define aworkpiece receiver 30. In the illustrated embodiment, upper portions 42of guides 40 form upper portions of workpiece receivers 30 configured toaccept or receive electronic device workpieces W. Upper portions 42guide the workpieces into bay 11 of workpiece carrier 10.

Referring to FIG. 6, an array 43 of lower portions 44 of guides 40 areshown. Corresponding to upper portions 42, pairs of lower portions 44 ofguides 40 also define workpiece receivers 30 adapted to receive and holdelectronic device workpieces W therein. Lower portions 44 of guides 40align and hold electronic device workpieces W positioned within bay 11.In the preferred embodiment of the invention, all guides 40 includelower portions 44 although only seven lower portions are shown in FIG.6.

Referring to FIG. 7, an arrangement of electronic device workpieces Wwithin workpiece carrier 10 in accordance with a first embodiment of theinvention is shown. Only an exemplary number of guides 40 and workpiecereceivers 30 defined thereby are shown in FIG. 7. In preferredimplementations, the depicted arrangement of electronic deviceworkpieces W is repeated along the entire sides 14, 15 of workpiececarrier 10.

Four electronic device workpieces W₁-W₄ are shown received and held bycorresponding workpiece receivers 30 in FIG. 7. Individual workpieces Winclude a front surface and a back surface. Front and back surfaces ofelectronic device workpieces W₁-W₄ are indicated by If the letters “F”and “B”, respectively. Front surfaces generally refer to the surfaces ofworkpieces W which typically receive the predominate portion of theprocessing. For example, components (e.g., semiconductive components) orelectrical circuitry are typically fabricated upon front surfaces of theworkpieces W. Exemplary electrical circuitry includes logic circuitryand memory circuitry.

Alternately considered, surfaces of adjacent workpieces can be referredto as first like surfaces and second like surfaces. First like surfacescan refer to either front surfaces or back surfaces of the workpieces,and second like surfaces can refer to either back surfaces or frontsurfaces of the workpieces, respectively.

The electronic device workpieces W are arranged such that a frontsurface F of an electronic device workpiece faces a front surface F ofan immediately adjacent electronic device workpiece (e.g. electronicdevice workpieces W₁ and W₂). Additionally, electronic device workpiecesW are arranged such that a back surface of an electronic deviceworkpiece faces a back surface of an immediately adjacent electronicdevice workpiece (e.g. electronic device workpieces W₂ and W₃).

For reference herein, electronic device workpieces W may be referred toas pairs where appropriate. For example, one pair P₁ includes electronicdevice workpieces W₁ and W₂ and another pair P₂ comprises electronicdevice workpieces W₂ and W₃. Electronic device workpiece W₂ is common toboth described pairs P₁, P₂ of electronic device workpieces 44.

In accordance with one embodiment of the present invention, an empty orunused workpiece receiver 30 is provided intermediate the electronicdevice workpieces W₁, W₂ of the pair P₁. Further, electronic deviceworkpieces W₂, W₃ of the pair P₂ are provided in immediately adjacentworkpiece receivers 30. Spacing the electronic device workpieces W₁, W₂of the pair P₁ by an empty workpiece receiver 30 provides a double orfull spaced distance “d₁” intermediate the respective front surfaces ofelectronic device workpieces W₁, W₂. Provision of the electronic deviceworkpieces W₂, W₃ of the pair P₂ within immediately adjacent workpiecereceivers 30 provides a single or half spaced distance “d₂” intermediatethe respective back surfaces of electronic device workpieces W₂, W₃.

Distances d₁ and d₂ are different in preferred embodiments of theinvention. In particular, the distance d₁ intermediate the frontsurfaces of electronic device workpieces W₁, W₂ is greater than thedistance d₂ intermediate the back surfaces of electronic deviceworkpieces W₂, W₃. Separating the front surfaces of the electronicdevice workpieces W by an increased distance improves the exposure ofthe front surfaces to processing chemicals. The provision of increasedspacing in accordance with the present invention optimizes flow ofprocessing fluids over the front surfaces of the electronic deviceworkpieces W. The spacing of the front surfaces of the electronic deviceworkpieces W is preferably sufficient to provide complete exposure ofthe front surfaces to the etching or other processing fluids. In someprocesses, it is desired to provide complete cleaning of the frontsurfaces of the electronic device workpieces W while processing of theback surfaces may be of no concern.

In other processes, processing of the back surfaces of workpieces W isdesired (e.g., removing an organic layer from the back surfaces). Thus,electronic device workpieces W can be arranged within workpiece carrier10 providing increased spacing intermediate faced back surfaces ofimmediately adjacent workpieces compared with the spacing providedintermediate faced front surfaces of immediately adjacent workpieces.For example, an empty workpiece receiver 30 can be provided intermediateworkpieces W₂, W₃. In such an arrangement, distance d₂ intermediate theback surfaces of workpieces W₂, W₃ is greater than distance d₁intermediate the front surfaces of workpieces W₁, W₂.

Arrangement of electronic device workpieces W within workpiece carrier10 in accordance with the present invention increases processingthroughput. For example, seventeen electronic device workpieces W areprovided within a full V-slot spacing workpiece carrier 10 as shown inFIG. 1. Only thirteen electronic device workpieces W can be stored in asimilar workpiece carrier 10 using conventional arrangement methods.

Referring to FIG. 8, another arrangement of electronic device workpiecesW within workpiece carrier 10 is depicted. Only an exemplary number ofguides 40 and workpiece receivers 30 defined thereby are shown in FIG.8. In preferred implementations, the depicted arrangement of electronicdevice workpieces W is repeated along the entire sides 14, 15 includingthe workpiece receivers 30 of workpiece carrier 10. Similar to FIG. 7,one pair P₁ of electronic device workpieces includes workpieces W₁, W₂.Another pair P₂ of electronic device workpieces includes workpieces W₂,W₃. Electronic device workpiece W₂ is common to both described pairs P₁,P₂ of electronic device workpieces. Two empty workpiece receivers 30 areprovided intermediate electronic device workpieces W₁, W₂ comprising thepair P₁ according to the aspect of the invention shown in FIG. 8. Morethan two empty workpiece receivers 30 are provided intermediate thefront surfaces F of electronic device workpieces W₁, W₂ in otherembodiments.

Providing the empty workpiece receivers 30 provides a distance d₁intermediate the front surfaces F of electronic device workpieces W₁,W₂. The distance d₁ shown in FIG. 8 is even greater than the distance d₁shown in FIG. 7. The arrangement shown in FIG. 8 provides additionalspacing intermediate front surfaces F of immediately adjacent electronicdevice workpieces W₁, W₂ of the first pair P₁. In the depictedembodiment, the electronic device workpieces W₂, W₃ of the other pair P₂are provided in immediately adjacent workpiece receivers 30. Inaddition, the back surfaces of electronic device workpieces W₂, W₃ ofpair P₂ face one another as shown in FIG. 8.

Distance d₁ separating front surfaces F of immediately adjacentelectronic device workpieces W₁, W₂ is greater than distance d₂separating back surfaces B of immediately adjacent electronic deviceworkpieces W₂, W₃. Separating the front surfaces F of the electronicdevice workpieces W by an increased distance improves the exposure ofthe front surfaces F to processing chemicals.

Referring to FIG. 9, another embodiment of the present invention isshown. Although only an exemplary portion of workpiece carrier 10 isshown in FIG. 9, the depicted arrangement of electronic deviceworkpieces W is repeated across the entire length of workpiece carrier10 and sides 14, 15 thereof in a preferred embodiment.

Guides 40, 40 a having differing widths are shown in FIG. 9. Asillustrated, guides 40 a individually have a greater width compared withthe width of individual guides 40. Two exemplary pairs P₁, P₂ ofelectronic device workpieces are shown in FIG. 9. One pair P₁ ofelectronic device workpieces includes workpieces W₁, W₂ which straddleguide 40 a. Front surfaces F of the electronic device workpieces W₁, W₂of the first pair P₁ face one another. Straddling of guide 40 a providesa distance d₁ intermediate front surfaces F of immediately adjacentelectronic device workpieces W₁, W₂ of first pair P₁.

Another pair P₂ of electronic device workpieces, including workpiecesW₂, W₃, straddles a thinner guide 40 as shown. The back surfaces ofelectronic device workpieces W₂, W₃ face one another in the arrangementshown in FIG. 9. Straddling of the pair P₂ of workpieces W₂, W₃ aboutguide 40 spaces the back surfaces B of the respective electronic deviceworkpieces W₂, W₃ by a distance d₂. Electronic device workpiece W₂ iscommon to the pairs P₁, P₂ of electronic device workpieces includingworkpieces W₁, W₂ and workpieces W₂, W₃, respectively.

Distance d₁ separating front surfaces F of immediately adjacentelectronic device workpieces W₁, W₂ is greater than distance d₂separating back surfaces B of immediately adjacent electronic deviceworkpieces W₂, W₃. Separating the front surfaces F of the electronicdevice workpieces W by an increased distance improves the exposure ofthe front surfaces to processing chemicals and facilitates processing ofthe workpieces.

Referring to FIG. 10, a workpiece carrier 10 is shown within a workpieceprocessor 50. The illustrated workpiece carrier 10 includes a pluralityof electronic device workpieces W. Workpiece processor 50 is configuredto provide processing of the electronic device workpieces W in thedescribed embodiment. Preferably, workpiece processor 50 provides wetprocessing of electronic device workpieces W. For example, workpieceprocessor 50 may be configured to implement processing of the electronicdevice workpieces W which includes removing organic materials from theelectronic device workpieces as disclosed in U.S. Pat. No. 5,464,480 toMatthews, incorporated herein by reference.

The illustrated workpiece processor 50 includes nozzles 52 configured tospray processing chemicals (liquid or gas) toward workpiece carrier 10and electronic device workpieces W therein. In other embodiments,workpiece processor 50 is configured to quench the electronic deviceworkpieces W. In such a configuration, workpiece carrier 10 andworkpieces W are dipped into a process solution within the workpieceprocessor. The process solution is then flowed past the surfaces of theworkpieces W. The present invention is not limited to the describedprocessing methods.

Arrangement of electronic device workpieces W within the workpiececarrier 10 in accordance with the present invention facilitates coverageof processing fluids across the entire front surfaces of the respectiveelectronic device workpieces W. Although preferred, processing of theelectronic device workpieces W in accordance with the present inventionis not limited to wet processing applications.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method of processing electronic deviceworkpieces, individual electronic device workpieces having a frontsurface and a back surface, the method comprising: providing anelectronic device workpiece carrier including a plurality of workpiecereceivers; positioning individual electronic device workpieces withinthe workpiece receivers, the positioning orienting the front surface ofone electronic device workpiece to face the front surface of a firstimmediately adjacent electronic device workpiece and orienting the backsurface of the one electronic device workpiece to face the back surfaceof a second immediately adjacent electronic device workpiece; andpositioning the electronic device workpiece carrier within an electronicdevice workpiece processor after the positioning of the individualelectronic device workpieces, and processing the electronic deviceworkpieces with the electronic device workpieces so oriented within theworkpiece carrier.
 2. The method according to claim 1 furthercomprising: spacing the one electronic device workpiece and the firstimmediately adjacent electronic device workpiece a first distance; andspacing the one electronic device workpiece and the second immediatelyadjacent electronic device workpiece a second distance less than thefirst distance.
 3. The method according to claim 1 wherein theprocessing comprises wet processing the electronic device workpieces. 4.The method according to claim 1 wherein the providing the electronicdevice workpiece carrier comprises providing a wafer cassette.
 5. Amethod of processing electronic device workpieces, individual electronicdevice workpieces having a front surface and a back surface, the methodcomprising: providing electronic device workpieces within a workpiececassette including orienting at least one first pair of immediatelyadjacent electronic device workpieces with their front surfaces facingone another and at least one other pair of immediately adjacentelectronic device workpieces with their back surfaces facing oneanother; and processing the electronic device workpieces as so orientedwithin the workpiece cassette.
 6. The method according to claim 5wherein the processing comprises wet processing the electronic deviceworkpieces.
 7. The method according to claim 5 wherein the orientingcomprises orienting with an electronic device workpiece common to thefirst and other pairs.
 8. The method according to claim 5 wherein theorienting comprises orienting a plurality of first and other pairs. 9.The method according to claim 5 further comprising: spacing the firstpair of electronic device workpieces a first distance; and spacing theother pair of electronic device workpieces a second distance less thanthe first distance.
 10. The method according to claim 5 furthercomprising: spacing the first pair of electronic device workpieces afirst distance; and spacing the other pair of electronic deviceworkpieces a second distance greater than the first distance.
 11. Amethod of processing plural electronic device workpieces having firstsurfaces and second surfaces, the method comprising: providingelectronic device workpieces within a workpiece cassette includingorienting at least one first pair of immediately adjacent electronicdevice workpieces with their first surfaces facing one another and atleast one other pair of immediately adjacent electronic deviceworkpieces with their second surfaces facing one another; and processingthe electronic device workpieces as so oriented within the workpiececassette.
 12. The method according to claim 11 wherein the processingcomprises wet processing the electronic device workpieces.
 13. Themethod according to claim 11 wherein the orienting comprises orientingwith an electronic device workpiece common to the first and other pairs.14. The method according to claim 11 wherein the orienting comprisesorienting a plurality of first and other pairs.
 15. The method accordingto claim 11 further comprising: spacing the first pair of electronicdevice workpieces a first distance; and spacing the other pair ofelectronic device workpieces a second distance less than the firstdistance.
 16. A method of processing electronic device workpiecescomprising: providing electronic device workpieces within a workpiececassette including orienting at least one first pair of immediatelyadjacent electronic device workpieces farther apart than at least oneother pair of immediately adjacent electronic device workpieces; andprocessing the electronic device workpieces as so oriented within theworkpiece cassette.
 17. The method according to claim 16 wherein theprocessing comprises wet processing the electronic device workpieces.18. The method according to claim 16 wherein the orienting comprisesorienting with one electronic device workpiece common to the first andother pairs.
 19. The method according to claim 16 wherein the orientingcomprises orienting a plurality of the first and other pairs.
 20. Themethod according to claim 16 wherein the orienting comprises facingfront surfaces of the at least one first pair of electronic deviceworkpieces with one another and facing back surfaces of the at least oneother pair of electronic device workpieces with one another.
 21. Themethod according to claim 16 wherein the orienting comprises facingfirst surfaces of the at least one first pair of electronic deviceworkpieces with one another and facing second surfaces of the at leastone other pair of electronic device workpieces with one another.
 22. Amethod of processing electronic device workpieces, individual electronicdevice workpieces having a front surface and a back surface, the methodcomprising: providing electronic device workpieces within a workpiececarrier having a plurality of guides configured to define workpiecereceivers which extend a distance at least half a diameter of a givenone of the electronic device workpieces, the providing comprisingorienting at least one first pair of immediately adjacent electronicdevice workpieces with their front surfaces facing one another and atleast one other pair of immediately adjacent electronic deviceworkpieces with their back surfaces facing one another, and orientingthe electronic device workpieces of the at least one other pair closertogether than the electronic device workpieces of the at least one firstpair; and processing the electronic device workpieces as so orientedwithin the workpiece carrier.
 23. The method according to claim 22wherein the processing comprises wet processing the electronic deviceworkpieces.
 24. The method according to claim 22 wherein the orientingcomprises orienting with one electronic device workpiece common to thefirst and other pairs.
 25. The method according to claim 22 wherein theorienting comprises orienting a plurality of the first and other pairs.26. The method according to claim 22 wherein the providing comprisesproviding the electronic device workpieces within the workpiece carriercomprising a wafer cassette.
 27. A method of positioning electronicdevice workpieces within an electronic device workpiece cassette,individual electronic device workpieces having a front surface and aback surface, the method comprising: providing an electronic deviceworkpiece cassette having a plurality of spaced workpiece receivers, theworkpiece receivers being individually configured to receive anelectronic device workpiece; and orienting a plurality of electronicdevice workpieces within the workpiece receivers including orienting atleast one first pair of immediately adjacent electronic deviceworkpieces with their front surfaces facing one another and at least oneother pair of immediately adjacent workpieces with their back surfacesfacing one another.
 28. The method according to claim 27 wherein theorienting comprises orienting with at least one electronic deviceworkpiece common to the first and other pairs.
 29. The method accordingto claim 27 wherein the orienting comprises orienting a plurality offirst and other pairs.
 30. The method according to claim 27 furthercomprising: spacing the first pair of electronic device workpieces afirst distance; and spacing the other pair of electronic deviceworkpieces a second distance less than the first distance.
 31. Themethod according to claim 27 further comprising: spacing the first pairof electronic device workpieces a first distance; and spacing the otherpair of electronic device workpieces a second distance greater than thefirst distance.
 32. A method of positioning plural electronic deviceworkpieces within an electronic device workpiece carrier, the electronicdevice workpieces having first surfaces and second surfaces, the methodcomprising: providing an electronic device workpiece carrier having aplurality of guides which define spaced workpiece receivers which extenda distance at least half a diameter of a given one of the electronicdevice workpieces and are individually configured to receive anelectronic device workpiece; and orienting a plurality of electronicdevice workpieces within the workpiece receivers including orienting atleast one first pair of immediately adjacent electronic deviceworkpieces with their first surfaces facing one another and at least oneother pair of immediately adjacent workpieces with their second surfacesfacing one another.
 33. The method according to claim 32 wherein theorienting comprises orienting with at least one electronic deviceworkpiece common to the first and other pairs.
 34. The method accordingto claim 32 wherein the orienting comprises orienting a plurality offirst and other pairs.
 35. The method according to claim 32 furthercomprising: spacing the first pair of electronic device workpieces afirst distance; and spacing the other pair of electronic deviceworkpieces a second distance less than the first distance.
 36. Themethod according to claim 32 wherein the providing the electronic deviceworkpiece carrier comprises providing a wafer cassette.
 37. A method ofpositioning electronic device workpieces within an electronic deviceworkpiece cassette, the method comprising: providing an electronicdevice workpiece cassette having a plurality of spaced workpiecereceivers, the workpiece receivers being individually configured toreceive an electronic device workpiece; and orienting a plurality ofelectronic device workpieces within the workpiece receivers includingorienting at least one first pair of immediately adjacent electronicdevice workpieces farther apart than at least one other pair ofimmediately adjacent electronic device workpieces.
 38. The methodaccording to claim 37 wherein the orienting comprises orienting with oneelectronic device workpiece common to the first and other pairs.
 39. Themethod according to claim 37 wherein the orienting comprises orienting aplurality of first and other pairs.
 40. The method according to claim 37wherein the orienting comprises facing front surfaces of the at leastone first pair of electronic device workpieces with one another andfacing back surfaces of the at least one other pair of electronic deviceworkpieces with one another.
 41. The method according to claim 37wherein the orienting comprises facing first surfaces of the at leastone first pair of electronic device workpieces with one another andfacing second surfaces of the at least one other pair of electronicdevice workpieces with one another.
 42. A method of positioningelectronic device workpieces within an electronic device workpiececassette, individual electronic device workpieces having a front surfaceand a back surface, the method comprising: providing an electronicdevice workpiece cassette having a plurality of spaced workpiecereceivers, the workpiece receivers being individually configured toreceive an electronic device workpiece; and orienting a plurality ofelectronic device workpieces within the workpiece receivers includingorienting at least one first pair of immediately adjacent electronicdevice workpieces with their front surfaces facing one another and atleast one other pair of immediately adjacent electronic deviceworkpieces with their back surfaces facing one another, and orientingthe electronic device workpieces of the at least one first pair fartherapart than the electronic device workpieces of the at least one otherpair.
 43. The method according to claim 42 wherein the orientingcomprises orienting with one electronic device workpiece common to thefirst and other pairs.
 44. The method according to claim 42 wherein theorienting comprises orienting a plurality of first and other pairs. 45.A method of positioning electronic device workpieces within anelectronic device workpiece carrier, the method comprising: providing anelectronic device workpiece carrier including a plurality of workpiecereceivers, the workpiece receivers being individually configured toreceive an electronic device workpiece; and orienting a plurality ofelectronic device workpieces within the workpiece receivers, theorienting including forming a plurality of pairs of electronic deviceworkpieces within immediately adjacent workpiece receivers and spacingthe pairs of electronic device workpieces by an empty workpiecereceiver.
 46. The method according to claim 45 wherein the forming thepairs comprises facing back surfaces of the electronic deviceworkpieces.
 47. The method according to claim 45 wherein the providingthe electronic device workpiece carrier comprises providing a wafercassette.
 48. A method of processing a plurality of electronic deviceworkpieces, individual electronic device workpieces having a frontsurface and a back surface, the method comprising: providing anelectronic device workpiece cassette having a plurality of guidesconfigured to define workpiece receivers which extend a distance atleast half a diameter of a given electronic device workpiece, theworkpiece receivers being individually configured to hold an electronicdevice workpiece in a vertical orientation; orienting a plurality ofelectronic device workpieces using the workpiece receivers includingorienting a front surface of one electronic device workpiece to face afront surface of a first immediately adjacent electronic deviceworkpiece forming one pair of electronic device workpieces and furtherorienting a back surface of the one electronic device workpiece to facea back surface of a second immediately adjacent electronic deviceworkpiece forming another pair of electronic device workpieces, theorienting further including spacing the electronic device workpieces ofthe one pair a first distance from one another and spacing theelectronic device workpieces of the another pair a second distance fromone another, the second distance being less than the first distance;positioning the electronic device workpiece cassette having the pairs ofelectronic device workpieces oriented therein within an electronicdevice workpiece processor; and wet processing the electronic deviceworkpieces with the electronic device workpieces so oriented within theelectronic device workpiece cassette.
 49. A method of transportingelectronic device workpieces relative to a processing device configuredto process the electronic device workpieces, the method comprising:providing a workpiece cassette; orienting a plurality of electronicdevice workpieces within the workpiece cassette, the orientingcomprising spacing at least one of the electronic device workpieces atdifferent distances from immediately adjacent electronic deviceworkpieces; and inserting the workpiece cassette having the electronicdevice workpieces as so oriented within the processing device.
 50. Themethod according to claim 49 wherein the orienting further comprises:orienting a front surface of one electronic device workpiece to face afront surface of a first immediately adjacent electronic deviceworkpiece; and orienting a back surface of the one electronic deviceworkpiece to face a back surface of a second immediately adjacentelectronic device workpiece.
 51. The method according to claim 49wherein the orienting further comprises: spacing the one electronicdevice workpiece and the first immediately adjacent electronic deviceworkpiece a first distance; and spacing the one electronic deviceworkpiece and the second immediately adjacent electronic deviceworkpiece a second distance less than the first distance.